| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MT48LC16M16A2P-6A | 存储IC |
MICRON/美光 |
TSOP |
0438+ |
5058 |
|||
| KLMBG2JETD-B041 | IC |
SAMSUNG/三星 |
BGA |
22+ |
4480 |
|||
| K4B4G1646E-BYMA | IC |
SAMSUNG/三星 |
20+21+ |
34720 |
||||
| MT41K256M16TW-107:P | 存储IC |
MICRON/美光 |
BGA |
22+ |
2000 |
|||
| GM71V18163CT6 | LGS |
TSOP |
9935+ |
1697 |
||||
| MX29LV160CBTC-90G | MXIC/旺宏 |
TSOP |
06+ |
9963 |
||||
| K9WAG08U1A-PCBO | 其他被动元件 |
SAMSUNG/三星 |
737+ |
59 |
||||
| DP83840AVCE | IC |
NS/美国国半 |
00+ |
42 |
||||
| K9G4G08UOB-PCBO | 内存芯片 |
SAMSUNG/三星 |
TSOP |
1022+ |
960 |
|||
| K9F1G08UOD-SCBO | 其他IC |
SAMSUNG/三星 |
TSOP |
1310+ |
1488 |
|||
| MX29LV320ATTI-90 | MXIC/旺宏 |
TSOP |
04+ |
1650 |
||||
| KLMCG4JETD-B041 | IC |
SAMSUNG/三星 |
4480 |
|||||
| K9G4G08UOB-PCBO | 内存芯片 |
SAMSUNG/三星 |
1019+ |
3840 |
||||
| BS62LV2000STC-70 | BSI |
0042+ |
2334 |
|||||
| LH28F640BFHE-PTTL80 | SHARP/夏普 |
TSOP |
04+ |
1616 |
||||
| HYB39L128160AT-7.5 | Infineon/英飞凌 |
0438+ |
485 |
|||||
| KM29V040T | SAMSUNG/三星 |
TSOP |
0830+ |
5561 |
||||
| TB62D516FG | 存储IC |
TOSHIBA/东芝 |
QFP |
16+ |
900 |
|||
| TC58BVG1S3HBAI4 | IC |
TOSHIBA/东芝 |
BGA |
2017+ |
2900 |
|||
| HY628100BLLG-70 | 内存芯片 |
SKHYNIX/海力士 |
02+ |
22 |
||||
| HY57V281620HCTP-P | SKHYNIX/海力士 |
04+ |
3 |
|||||
| K4S281632D-TC75 | 内存芯片 |
SAMSUNG/三星 |
0203+ |
8 |
||||
| K4S281632F-TC75 | 其他被动元件 |
SAMSUNG/三星 |
419+ |
12 |
||||
| HY57V281620HCT-P | SKHYNIX/海力士 |
0304+ |
36 |
|||||
| MT29F1G08ABADAWP:D | 存储IC |
MICRON/美光 |
TSOP |
1220+ |
71 |
|||
| K9F1208U0B-PCB0 | 其他被动元件 |
SAMSUNG/三星 |
TSOP |
04+05+ |
590 |
|||
| K9G4G08UOB-PCBO | 内存芯片 |
SAMSUNG/三星 |
TSOP |
1019+ |
3840 |
|||
| K9F1G08UOD-SIBO | 内存芯片 |
SAMSUNG/三星 |
TSOP |
1401+ |
173 |
|||
| KLMCG2UCTB-B041T02 | 存储IC |
SAMSUNG/三星 |
BGA-96 |
23+ |
20000 |
|||
| HY27UT084G2A-TPCB | 内存芯片 |
SKHYNIX/海力士 |
950+ |
1630 |